Disruptive Innovation Technology Solutions
HVM OPTICAL METROLOGY for FEOL & BEOL Advanced Semiconductor Metrology for FAB Yield Enhancement
One Architecture, Many Processes - 300mm Advanced HVM FAB Tools. S-Cubed’s Scene architecture allows for stacked spin bowl and hotplate modules, ensuring the most resources in the smallest footprint for processing wafers up to 300 mm in diameter. Decades of semiconductor process expertise delivering:
Angstrom Spatial Resolution of Subsurface Features Measured Via 30THz_CW Time Domain Nanoscanning Spectrometer & Imager - NO SAMPLE PREP - TeraSpectra
Wafer and substrate material processing include Silicon, Sapphire, Aluminum Nitride, Quartz, Gallium Nitride, Gallium Arsenide, Ceramics, Composites, Metal Alloys, Aluminum, & Tungsten.
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